Hybrid Bonding

DB-22H Ultra is a die bonder machine designed for advanced C2W-WLP (Chip to Wafer-Wafer Level Packaging) processes. It features dual gantries and dual bonding heads operating simultaneously to achieve high throughput rates. It supports both Flip and non-Flip functions and employs low-contact input carriers to enhance die bonding yield.

Product Specifications:

• Accuracy/UPH: ±0.2μm, Up to 2K
• Bonding Force: 0.5 – 30N
• Die Size: 5-30mm
• Die Thickness: 50-300μm
• Input: 12” Frame, Tray
• Output Size: 12” Wafer