Hybrid Bonding

DB-22H Ultra

DB-22H Ultra is a die bonder machine designed for advanced C2W-WLP (Chip to Wafer-Wafer Level Packaging) processes. It features dual gantries and dual bonding heads operating simultaneously to achieve high throughput rates. It supports both Flip and non-Flip functions and employs low-contact input carriers to enhance die bonding yield.

Product Specifications:

  • Accuracy/UPH: ±0.2μm, Up to 2K
  • Bonding Force: 0.5 – 30N
  • Die Size: 5-30mm
  • Die Thickness: 50-300μm
  • Input: 12” Frame, Tray
  • Output Size: 12” Wafer