FOB

The ST-668 is designed for the precise sorting, mixing, and arrangement of wafer chips based on mapping data. Using computer-generated information, it calculates the arrangement of chips into specific coordinates within designated Bin Frames or substrates. This allows for simultaneous sorting, mixing, and accurate arrangement of chips onto the designated positions of the Bin Frame film (or substrate). The substrate must be pre-coated with an adhesive film or have adhesive properties for chip placement. The chip placement positions are marked with alignment indicators, ensuring a broad accuracy of up to 10 micrometers.

Product Specifications:

• Cycle Time & Place Accuracy:With alignment pattern for chip placement: 90ms，X, Y accuracy: ±10um & θ ≦ ±2°@3σ (for chip size 200um x 200um，Pitch within 500um). Without alignment pattern for chip placement: 70ms,X, Y accuracy: ±15um & θ ≦ ±2° @3σ (for chip size 200um x 200um，Pitch within 500um)
• Scan Detection Rate: > 99.95%
• Chip Size: 3mil x 5mil ~ 20mil x 20mil，80μm ≤ T ≤ 200um
• Substrate:Maximum effective area: 1. Square 214mm x 170mm. Bin Frame size: 205mm x 205mm x 1.2Tmm, 286mm x 286mm x 1.2Tmm

RP-06 is designed for removing and re-bonding defective chips on the substrate before reflow, providing excellent AOI (Automated Optical Inspection) functionality to scan the substrate and identify the chips that need to be removed. It offers a variety of tools suitable for process rework. Additionally, to meet post-reflow repair needs, the equipment can be equipped with a laser reflow module, allowing for single-point laser reflow soldering for re-tinning and chip repair.

• AOI functionality for scanning and locating the substrate, removing defective chips (such as skewed, standing, or missing chips) before reflow, and scanning to ensure sufficient solder paste coverage.
• Rework is performed in case of abnormalities, offering post-reflow single-point re-tinning, chip repair, and IR laser reflow (defective products need to be removed separately), with the ability to output Repairing mapping data.
• Four types of pre-reflow repair function modules: chip removal module, chip repair module, solder paste removal module, solder paste application module, along with an additional IR laser reflow module for post-reflow repair.
• Chip repair accuracy: XY ±15μm, θ ±3° @3σ.
• Dispensing specification: Dot area 85%~115%.
• Silicon film repair yield: 99%.
• Substrate: Suitable for 92mm x 134mm ~ 286mm x 286mm. The substrate is not limited to being attached to frame adhesive film, glass, or PCB.
• Chip Size: 90μm x 127μm ~ 1.5mm x 1.5mm; 75μm ≤ T ≤ 350μm.

• Rapid and full-surface positioning of pre-arranged chips, ensuring even pressure and adhesion to the substrate.
• Chip positioning remains unaffected by substrate deformation, ensuring tight adhesion even in the presence of substrate warping.
• Automation of process actions, replacing manual intervention requirements.
• High-resolution optical system capable of capturing images in large matrices.
• Infrared heating for chip bonding, heating only the surface of the substrate without affecting the backside IC soldering.
• Equipped with an observation optical system for parameter adjustment testing to observe conditions inside the oven.

Product Specifications:

• Chip Substrate Alignment and Bonding: ≤ 75 seconds, Alignment Accuracy: X, Y ≤ ±5um/200mm x 200mm (average error at four corners).
• Single-board Placement and Clamping, Heating, and Soldering: ≤ 50 seconds, Maximum Temperature: ≤ 300°C.
• Applicable Material Specifications: PCB: ≤ 230mm x 230mm, Total Thickness: ≤ 29.0mm (including carrier board); Glass-bonded Products: ≤ 230mm x 230mm, Thickness: ≤ 5mm.