Fanout

GB-20S is a panel-level high-speed die bonder that operates on the principle of batch die bonding. It pre-arranges the die on the bonding head before performing the entire group bonding process, achieving high-speed die bonding performance on large substrates. It can operate on substrates pre-coated with adhesive material, solder paste, flux, or double-sided adhesive film. The die tape frame can automatically load and unload, while the substrate requires manual loading and unloading.

• Adopts the operation mode of pre-arranging and then bonding the entire group of dies, meeting the high production capacity requirements on large substrates. • The bonding compression time is relatively sufficient compared to single die operations, which can improve adhesive reliability. • The main spindle adopts linear motor drive to maintain long-term accuracy in picking and placing. • Immediate confirmation of picking status after picking to eliminate potential subsequent damage caused by picking errors. • Immediate inspection of placement results after pre-arrangement. • Flip and non-flip dual-use.

Product Specifications:

GB-40 is a batch die bonder with a multi-to-one architecture, designed to achieve high-speed die bonding performance on large substrates using the principle of batch die bonding. It employs multiple pre-alignment machines corresponding to the bonding machine structure, equipped with multiple sets of pre-alignment systems to significantly increase throughput and enable the bonding of multiple types of dies in a single operation. It can operate on substrates pre-coated with adhesive material, solder paste, flux, or covered with double-sided adhesive film.

• Flip-chip (face-down)/non-flip dual-use.
• Can be configured in parallel with multiple sets, enabling cross-group support to maximize application flexibility and resilience.
• Highly flexible production scenarios: freely configurable for single-wafer production of single-die products, multi-wafer production of single-die products, multi-wafer production of multi-die products, and other combinations.
• Flexible scheduling of one or multiple cassette modules, pre-alignment modules, and fault occurrences.
• The main spindle adopts linear motor drive to maintain long-term high precision, high speed, low dust generation, and easy maintenance.
• The pre-alignment block transfer system and wafer frame transport system move internally, minimizing the probability of collisions with personnel.
• Increased pre-alignment speed, shortened total equipment length, reasonable spatial configuration, and optimized throughput per unit area.
• Multiple calibration auxiliary functions to assist in quickly completing equipment setup tasks.

Product Specifications:

• Wafer size: 12” on standard DISCO frame (8” optional).
• Chip size: 0.5 x 0.5mm ~ 7.0 x 7.0mm, T=0.1 ~ 0.7mm.
• Substrate: 620mm x 620mm, 330mm x 330mm, Ø300mm, maximum bonding area: 600 x 600 mm, substrate pre-coated with adhesive material or covered with double-sided adhesive film.
• Bonding tool: 40 x 40mm ~ 80 x 80mm batch die bonder head. Custom designed tool shape.
• Bonding Accuracy: X/Y: ≦±10um/300mm, θ≦0.1°@3σ.
• Throughput: 6 kUPH/m^2 @chip size 3 x 3 mm (Flip and Non-flip operations are the same).
• Bonding Force: Maximum 60kgf, programmable setting.

The purpose of the ST-663 is to retrieve individual grains adhered to a film based on mapping data, sort them into designated bins, and neatly arrange them on the surface of a substrate. The substrate needs to be pre-coated with adhesive film, and the placement of grains must have alignment marks.

• Patented Wafer & Substrate vertical working position to reduce dust contamination.
• Ultra-short arm PP Arm to reduce mechanical vibration, improving stability in productivity and alignment accuracy.
• Adoption of a non-protruding film picking method to reduce impact force on the chips and minimize chip damage.
• After retrieving the chip, it is then positioned, and alignment with the alignment marks on the substrate is performed. The placement accuracy is ≤ ±10μm, and the angle accuracy is ≤ ±1° (3 sigma), with chip sizes ranging from 0.25mm to 1.2mm, under the condition of enabling the bin table θ angle compensation function (ensuring chip cutting appearance integrity).
• The system also includes Pick Die abnormal CCD image identification inspection and position compensation.
• With a 4 Heads Index structure, the Cycle Time is 175ms (for chip sizes between 0.25mm and 1.2mm), under the condition of the bin table θ not rotating.

ST-812R is a machine that can arrange cut semiconductor wafers on a film or adhesive substrate as required. It has the ability to achieve high speed and precision in picking and placing, and can retrieve and place the wafer on the film according to wafer mapping data. The wafer feeding mechanism can be used with a tape frame for 8″ frame production, while the bin feeding mechanism, equipped with a change kit and a large-area vacuum flat system, can be used for 320mm x 324mm frame or substrate production.

• High productivity, precision, and stability:
• Disco 8″ frame on the wafer end
• Automatic loading and unloading on the wafer end
• Maximum square placement range on the bin end: 290mm x 290mm, compatible with both frame and substrate
• Bin end equipped with a large vacuum flat suction system, adjustable flatness, and continues to function even during power failure to ensure uninterrupted operation
• Vertical frame design minimizes dust contamination and shortens pick-and-place distance
• Easy replacement of nozzles, top pins, and caps
• Simple structure for easy maintenance.

Product Specifications:

• Wafer size: 8″ (blue film or UV film)
• Chip size: 0.15mm x 0.15mm, T ≥ 100um, ≤ 500μm
• Cycle Time:≤144ms for chip size: 0.15 x 0.15mm ~ 1.0 x 1.0mm, spacing: ≤1.2mm. Cycle Time≤180ms for chip size: 1.0 x 1.0mm ~ 2.0 x 2.0mm, spacing: ≤2.2mm. Cycle Time≤240ms for chip size: 2.0 x 2.0mm ~ 3.5 x 3.5mm, spacing: ≤4.2mm
• Placement Accuracy:Initial point position and alignment symbol position error: ≤ ±50μm.Relative accuracy based on the aforementioned cycle time: ≤ ±15μm & θ ≤ ±1 degree, 99.9%, CPK 1.33.Absolute accuracy based on the aforementioned cycle time: ≤ ±25μm
• Wafer table: Disco DTF2-8-1, maximum expansion depth 12mm, adjustable with interchangeable fixtures. Working range: 8-inch Ø216mm @ Ø15mm cap

The DB-22H is a solid crystal machine designed for C2W Fan-Out Packaging. It features dual gantry and dual solid crystal heads operating simultaneously, enabling high throughput. Additionally, it supports both Flip and non-Flip functions, and comes with a rapid changeover feature for Dipping (face down) and non-Dipping processes.

Product Specifications:

• Accuracy/UPH : ±0.5umUp to 2K
• Force : 0.5 – 30N
• Die size : 0.3-30mm
• Die thickness :>50um
• Input : 12”Frame, Tray
• Output size : 12”Wafer

DB-22T is a solid bonding equipment suitable for C2W, Die stack, Micro-Bump packaging, featuring dual gantry & dual bonding heads for simultaneous operation, ensuring high throughput. It is designed with quick-change capabilities for both dipping (face down) and non-dipping processes.

Product Specifications:

• Accuracy/UPH: ±2umUp to 1K
• Force: 0.5 – 500N
• Bond Head Temperature: 450℃
• Substrate Temperature: 300℃
• Die size: 2-16mm
• Die thickness: >50um
• Input: 12”Frame, Tray
• Output size: 12”Wafer