CIS

The WS-12S is a fully automated, high cleanliness, high pick-and-place speed, and high placement accuracy tape frame to tape frame IC Mapping Sorter. It retrieves grains adhered to the film (resort) based on wafer mapping data and classifies them for placement onto their respective frames. It can sort into 1 bin (independent bin cassette) and up to 13 bins (single bin frame). The equipment’s input/output end can freely select and replace 8″ or 12″ kits, allowing sorting between frames of the same or different sizes.

• Vertical frame design minimizes dust contamination.
• Shortest distance for picking and placing arms, ensuring high-speed and stable arrangement with high precision.
• Strict map picking rules ensure sorting accuracy.
• Sensitivity program-controlled for failed picking sensor.
• Configured with special software functions: hole filling and bin connection.

Product Specifications:

• Wafer Size: Compatible with 8″ and 12″ Disco Frames
• Chip Size: 0.2mm x 0.2mm ~ 12mm x 12mm, T=100 ~ 800μm
• Cycle Time: 240ms for chip size 3mm x 3mm, T=150μm. Wafer to Bin, continuous picking of single bins. θ not corrected.
• Placement Accuracy: X, Y ±25μm & Angle ±1° @ 3σ (for Chip Size 3mm x 3mm)
• Die Bonding Working Area: 8″ø 200mm, 12″ø 300mm (requires fixture conversion)
• Loader Cassette: 1 (holds 13 pieces per cassette)
• Unloader Cassette: 1 (holds 13 pieces per cassette)
• Optical System Specifications: Wafer CCD, Bin CCD: Camera: 2MP monochrome, Lens: Zoom lens, Pixel: 3~19.15(μm), FOV: 4.8 x 3.6~30.6 x 22.9 (mm), Light Source: External coaxial light (red), Recommended 14 x 14 area for uniformity.

The WS-12T is a device capable of picking good products from 12-inch Flat Rings and then die bonding them onto 8-inch Flat Rings.

• Vertical frame design minimizes dust contamination.
• Shortest distance for picking and placing arms, ensuring high-speed and stable arrangement with high precision.
• Strict map picking rules ensure sorting accuracy.
• Sensitivity program-controlled for failed picking sensor.
• Configured with special software functions: hole filling and bin connection.

Product Specifications:

• Wafer Size: Compatible with 8” and 12” Disco Frames
• Chip Size: 0.2mm x 0.2mm ~ 12mm x 12mm, Thickness (T): 100 ~ 800μm
• Cycle Time: 240ms for chip size 3mm x 3mm, Thickness (T): 150μm. Wafer to Bin, continuous picking of single bins. θ not corrected.
• Placement Accuracy: X, Y ≤± 25μm & Angle ≤± 1° @ 3σ (for Chip Size 3mm x 3mm)
• Die Bonding Working Area: 8″ø 200mm, 12″ø 300mm (requires fixture conversion)
• Loader Cassette: 1 (holds 13 pieces per cassette), with expansion mechanism (motorized)
• Unloader Cassette: 3 (holds 25 pieces per cassette)
• Wafer CCD, Bin CCD: 1600×1200 pixels (monochrome). Lens: Internal coaxial. FOV: 3mm×3mm to 12mm×12mm. Light Source: External coaxial light (red), adjustable brightness.