The WS-212 is a fully automated Chip AOI (Automated Optical Inspection) equipment designed for high cleanliness, high pick-and-place speed, high placement accuracy, and high image resolution. It supports wafer sizes of 12-inch, 8-inch (standard) and 6-inch wafers, among others. Utilizing wafer mapping data, it performs sorting and pick & place proccess simultaneously.


  • Supports wafer sizes 12, 8(standard) and 6-inch on input and output
  • Capable of sorting production between different or identical sizes
  • Inspection of backside and four sides(optional) before placement, frontside inspection after placement
  • Vertical tables design minimizes pick & place distance, achieving industry-leading throughput: 14K/H
  • MTBF (Mean Time Between Failures) of at least 168 hours
  • MTTR (Mean Time To Repair) of less than 2 hours


  • Cycle time: 250ms per chip w/o AOI (UPH 14k). 350ms per chip with AOI (UPH 10k)
  • Placement Accuracy: X, Y ±25μm & Angle ≤±0.5°
  • Die Bonding Working Area: 8″ ø 200mm, 12″ ø 300mm
  • 4MP camera 0.5x Lens for positioning

*All stats are according standard criteria, specific evaluation on request


AI-10 is a semi-automatic, high-speed front-end inspection and appearance measurement device capable of outputting map files with inspection results.


  • Gantry structure minimizes footprint while optimizing stability
  • Inspection with mapping data input
  • Multiple automatic calibration functions assist in quick, convenient, and reliable machine setup
  • High-resolution optical inspection module
  • Supports high-speed front-end inspection
  • Multiple defect detection models
  • Flexible setting of chip inspection areas, with the ability to configure inspections under different conditions.
  • Real-time inspection results and data output
  • Real-time manual redo of inspection and update results in data.
  • Automatic brightness compensation during inspection.
  • Supports parallel computing on multiple PCs.


  • FOV of 25M+2x Top-Side AOI < 8.5 x 8.5 mm. Captures images of 2 chips simultaneously.  Inspection time per frame < 500ms.UPH (Units Per Hour) > 7200.
  • Cleanroom Specifications: Class 1000/100/10.
  • Wafer Table travel distance up to 8″ wafers.Utilizes quick fixtures to secure wafer frames.+/-15 degrees fine adjustment capability.
  • Front-Side AOI:Camera: 25MP monochrome.Lens: 1.5X magnification.Pixel Size (µm): 1.67.Field of View (FOV) (mm): 8.5 x 8.5.
  • Die Placement and Positioning Vision:Camera: 4MP monochrome.Lens: 0.5X magnification.Pixel Size (µm): 11.Field of View (FOV) (mm): 22.5 x 22.5.
  • AOI detection of chipping, white spots, black spots, dirt, cracks, and scratches.
*All stats are according standard criteria, specific evaluation on request