AOI
WS-212
The WS-212 is a fully automated Chip AOI (Automated Optical Inspection) equipment designed for high cleanliness, high pick-and-place speed, high placement accuracy, and high image resolution. It supports wafer sizes of 12-inch, 8-inch (standard) and 6-inch wafers, among others. Utilizing wafer mapping data, it performs sorting and pick & place proccess simultaneously.
Features:
- Supports wafer sizes 12, 8(standard) and 6-inch on input and output
- Capable of sorting production between different or identical sizes
- Inspection of backside and four sides(optional) before placement, frontside inspection after placement
- Vertical tables design minimizes pick & place distance, achieving industry-leading throughput: 14K/H
- MTBF (Mean Time Between Failures) of at least 168 hours
- MTTR (Mean Time To Repair) of less than 2 hours
Performance:
- Cycle time: 250ms per chip w/o AOI (UPH 14k). 350ms per chip with AOI (UPH 10k)
- Placement Accuracy: X, Y ±25μm & Angle ≤±0.5°
- Die Bonding Working Area: 8″ ø 200mm, 12″ ø 300mm
- 4MP camera 0.5x Lens for positioning
*All stats are according standard criteria, specific evaluation on request
AI-10
AI-10 is a semi-automatic, high-speed front-end inspection and appearance measurement device capable of outputting map files with inspection results.
Features:
- Gantry structure minimizes footprint while optimizing stability
- Inspection with mapping data input
- Multiple automatic calibration functions assist in quick, convenient, and reliable machine setup
- High-resolution optical inspection module
- Supports high-speed front-end inspection
- Multiple defect detection models
- Flexible setting of chip inspection areas, with the ability to configure inspections under different conditions.
- Real-time inspection results and data output
- Real-time manual redo of inspection and update results in data.
- Automatic brightness compensation during inspection.
- Supports parallel computing on multiple PCs.
Performance:
- FOV of 25M+2x Top-Side AOI < 8.5 x 8.5 mm. Captures images of 2 chips simultaneously. Inspection time per frame < 500ms.UPH (Units Per Hour) > 7200.
- Cleanroom Specifications: Class 1000/100/10.
- Wafer Table travel distance up to 8″ wafers.Utilizes quick fixtures to secure wafer frames.+/-15 degrees fine adjustment capability.
- Front-Side AOI:Camera: 25MP monochrome.Lens: 1.5X magnification.Pixel Size (µm): 1.67.Field of View (FOV) (mm): 8.5 x 8.5.
- Die Placement and Positioning Vision:Camera: 4MP monochrome.Lens: 0.5X magnification.Pixel Size (µm): 11.Field of View (FOV) (mm): 22.5 x 22.5.
- AOI detection of chipping, white spots, black spots, dirt, cracks, and scratches.
*All stats are according standard criteria, specific evaluation on request
