The semiconductor wafer manufacturing process has advanced to the 3-nanometer scale, with cutting-edge technologies such as 5G and AI being progressively introduced and implemented in the market. In response to market demands, Saultech is developing prototype concepts for nanoscale high-end packaging technology, initially targeting 0.3 micrometers. The company anticipates launching industry-applicable advanced high-end packaging equipment within the next 1 to 2 years.