NEWS

2019-09-12

Saultech’s Nanoscale Advanced Packaging Equipment Makes a Striking Impact on the Market

 

The semiconductor wafer manufacturing process has advanced to the 3-nanometer scale, with cutting-edge technologies such as 5G and AI being progressively introduced and implemented in the market. In response to market demands, Saultech is developing prototype concepts for nanoscale high-end packaging technology, initially targeting 0.3 micrometers. The company anticipates launching industry-applicable advanced high-end packaging equipment within the next 1 to 2 years.

 

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