Caption: Saultech showcases the GB-20S, a fan-out system-level packaging device, at SEMICON Taiwan 2024.
Saultech ’s core competitive advantage lies in its submicron Pick & Place technology, with precision below 1μm, used for die picking and placement in both LED and semiconductor applications. Currently, Saultech’s revenue from semiconductors has surpassed that from LEDs, helping the company break free from the challenges of the LED industry. The advanced packaging solutions developed by Saultech boast an impressive operational precision of 0.2μm.
With the rapid development of artificial intelligence (AI), the global technology market is undergoing unprecedented transformations. The strength of AI lies in its powerful data processing capabilities, which are driven by continuous advancements in semiconductor technology. Major global semiconductor manufacturers are introducing increasingly sophisticated manufacturing techniques. TSMC’s CoWoS technology not only enhances chip computing power but also reduces power consumption, providing critical support for the performance of AI systems. Intel’s glass substrate solution aims to overcome the limitations of organic materials, greatly improving the design requirements for future data centers and AI products.
As a leading manufacturer of Pick & Place equipment, Saultech is committed to providing the best Die Bond solutions for semiconductor manufacturing and packaging companies. At the 2024 SEMICON Taiwan “Heterogeneous Integration Pavilion,” Saultech will exhibit its fan-out system-level packaging equipment and unveil its Hybrid Bonding heterogeneous integration packaging solution. Spokesperson David Zeng mentioned that Saultech has been developing fan-out equipment for years, and solutions co-developed with leading packaging companies have passed client certifications. Equipment co-developed with a major wafer manufacturer is also set for official verification and delivery. In addition to these two major projects, Saultech received multiple orders in 2024 for CIS equipment used in automotive imaging safety monitoring and smartphones.
These achievements demonstrate Saultech ’s successful transformation from an LED picking equipment provider to an advanced semiconductor equipment supplier. With successful developments in fan-out machines and Hybrid Bonder solutions, Saultech’s business strategy focuses on technology research and development, as well as brand building. To uphold this vision, the company has established clean rooms and a precision optical laboratory. Saultech understands that such forward-thinking infrastructure investments are crucial to seamlessly meeting the prototype needs of world-class wafer manufacturing clients.
Hybrid Bonding offers superior signal transmission and heat dissipation, and many industry experts believe it will become the mainstream in advanced packaging. However, operational precision must meet the threshold of 0.1 to 0.05μm. In this field, companies like Besi and Shibaura lead the industry, with many other major firms eager to enter. Saultech has already taken the lead in this space, having completed its technological layout. Three years ago, the company partnered with the Industrial Technology Research Institute to invest in nano-level Hybrid Bonding technology development, self-developing key technologies such as Bonding Wave, and securing patents to raise industry barriers.
David Zeng stated that Saultech’s expertise in pre-arranged mass transfer die bonding equipment is particularly suited for high-integration processes such as fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP). This technology has attracted significant attention from semiconductor companies worldwide, especially in areas like 3D packaging and chiplet packaging.
This article is reprinted from:DIGITIMES
